United States Patent and Trademark Office, Patent Assignment 14312/408: Assignment Of Assignors Interest
Assignor
Assignee
Institute Of Microelectronics Paperwork Executed April 10, 2003
Recorded
Agency For Science, Technology And Research
Agency For Science, Technology And Research
Patents
Correspondent
Method To Form Cu/osg Dual Damascene Structure For High Performance And Reliable Interconnects
X0 Patent Application No.10410122 , Filed April 9, 2003
A1 Application Publication No.
Method To Form Cu/osg Dual Damascene Structure For High Performance And Reliable Interconnects
B2 Utility Patent No.6913994 , Issued July 5, 2005
George O. Saile
Updated July 5, 2005
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https://www.plainsite.org/patents/assignment.html?id=2662850
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