United States Patent and Trademark Office, Patent Assignment 21117/992: Assignment Of Assignors Interest
Assignors
Assignee
Ryu, Je Il Paperwork Executed April 2, 2008
Kim, You Sung Paperwork Executed April 2, 2008
Recorded
Hynix Semiconductor, Inc. Officially Listed As "Hynix Semiconductor Inc."
Hynix Semiconductor, Inc.
Patents
Correspondent
Multi-chip Package
X0 Patent Application No.12102701 , Filed April 14, 2008
A1 Application Publication No.
Multi-chip Package
B2 Utility Patent No.7885139 , Issued February 8, 2011
Steve Y. Cho Kilpatrick Townsend & Stockton, LLP
Updated February 8, 2011
View this assignment via USPTO Assignments on the Web
Statistics
This assignment has been viewed 3 times.
Information Facts
https://www.plainsite.org/patents/assignment.html?id=4182160
Primary Sources Government agencies: SEC/EDGAR, federal and state courts, USPTO, IRS, and others
AI text generation None AI document summarization None AI-augmented search None AI-generated images None AI chat or Q&A interface Linkable via MCP Third party AI contribution in government documents Possible
Document content is reproduced directly from government sources. Some filings in our database may themselves contain AI-generated content submitted by third parties to government agencies.
