United States Patent and Trademark Office, Patent Assignment 21192/324:
Assignment Of Assignors Interest

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Assignors
Assignee

Kim, Hyung Hwan
Paperwork Executed June 20, 2008

Chae, Kwang Kee
Paperwork Executed June 20, 2008

Jung, Jong Goo
Paperwork Executed June 20, 2008

Moon, Ok Min
Paperwork Executed June 20, 2008

Lee, Young Bang
Paperwork Executed June 20, 2008

Park, Sung Eun
Paperwork Executed June 20, 2008

Transfer

Recorded
July 3, 2008

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Hynix Semiconductor, Inc.
Officially Listed As "Hynix Semiconductor Inc."

Hynix Semiconductor, Inc.
San 136-1, Ami-ri, Bubal-eub, Ichon-shi
Kyoungki-do 467-860
SOUTH KOREA

Patents
Correspondent

Isolation Layer Having A Bilayer Structure For A Semiconductor Device And Method For Forming The Same

USX0Patent Application No. 12167322, Filed July 3, 2008

USA1Application Publication No. 20090267199, Issued October 29, 2009

Isolation Layer Having A Bilayer Structure For A Semiconductor Device And Method For Forming The Same

USB2Utility Patent No. 8841198, Issued September 23, 2014

Richard J. Streit
Ladas & Parry LLP
Chicago, IL 60604

Updated September 23, 2014

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