Patent Assignment from Park, Hyung-soon; Kwak, Noh Jung; Yeom, Seung Jin; Ryu, Choon Kun; Jung, Jong Goo; and Kim, Sung-jun to Hynix Semiconductor, Inc.

United States Patent and Trademark Office, Patent Assignment 22579/95:
Assignment Of Assignors Interest

Assignors		Assignee
Park, Hyung Soon Paperwork Executed April 3, 2009 Kwak, Noh Jung Paperwork Executed April 3, 2009 Yeom, Seung Jin Paperwork Executed April 3, 2009 Ryu, Choon Kun Paperwork Executed April 3, 2009 Jung, Jong Goo Paperwork Executed April 3, 2009 Kim, Sung Jun Paperwork Executed April 3, 2009	Recorded April 22, 2009	Hynix Semiconductor, Inc. Officially Listed As "Hynix Semiconductor Inc." Hynix Semiconductor, Inc. San 136-1, Ami-ri, Bubal-eub, Ichon-shi Kyoungki-do 467-860 SOUTH KOREA
Patents		Correspondent
Method For Forming Copper Wiring In A Semiconductor Device X0Patent Application No. 12427870, Filed April 22, 2009 A1Application Publication No. 20100210104, Issued August 19, 2010 Method For Forming Copper Wiring In A Semiconductor Device B2Utility Patent No. 8252686, Issued August 28, 2012		Richard J. Streit Ladas & Parry LLP Chicago, IL 60604

Updated August 28, 2012

View this assignment via USPTO Assignments on the Web

Statistics

This assignment has been viewed 4 times.

Sign In Sign Up

Issues Laws Cases News Firms Entities Pro

Sign In Sign Up