United States Patent and Trademark Office, Patent Assignment 27317/421: Assignment Of Assignors Interest
Assignors
Assignee
Kim, Bum Dol Paperwork Executed December 1, 2011
Kim, You Sung Paperwork Executed December 1, 2011
Recorded
Hynix Semiconductor, Inc. Officially Listed As "Hynix Semiconductor Inc."
Hynix Semiconductor, Inc.
Patents
Correspondent
Multi-chip Package And Operating Method Thereof
X0 Patent Application No.13310236 , Filed December 2, 2011
A1 Application Publication No.
Multi-chip Package And Operating Method Thereof
B2 Utility Patent No.8565027 , Issued October 22, 2013
Ip, & T.
Updated October 22, 2013
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Information Facts
https://www.plainsite.org/patents/assignment.html?id=5372930
Primary Sources Government agencies: SEC/EDGAR, federal and state courts, USPTO, IRS, and others
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