|
|
United States Patent and Trademark Office, Patent Assignment 36362/391:
Assignment Of Assignors Interest
|
|
Assignors
|
|
Assignee
|
Ebsen, Rylee
Paperwork Executed November 5, 2014
Jurgenson, Nathan
Paperwork Executed November 7, 2014
Marzolph, Ryan
Paperwork Executed November 5, 2014
Spiegel, Evan
Paperwork Executed November 10, 2014
|

Recorded
August 19, 2015
|

Snapchat, Inc.
Snapchat, Inc.
63 Market Street
Venice, CA 90291
|
Patents
|
|
Correspondent
|
Bonded Stacked Wafers And Methods Of Electroplating Bonded Stacked Wafers
X0Patent Application No. 14682259, Filed April 9, 2015
B1Utility Patent No. 9143681, Issued September 22, 2015
|
|
Schwegman, Lundberg & Woessner, PA
P. O. BOX 2938
MINNEAPOLIS MN 55402
|
|
Updated September 22, 2015 |
|
|
View this assignment via USPTO Assignments on the Web
Statistics
This assignment has been viewed 5 times.
|
|
|
|