C. Uyemura & Company, Ltd.
 United States C Corporation
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Inside Counsel (0)
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Outside Counsel (30)
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Olexyuire |
Peter |
D. |
Sughrue Mion, PLLC |
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Biggart |
Waddell |
Alexander |
Sughrue Mion, PLLC |
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Oliff |
James |
A. |
Oliff & Berridge, PLC |
ALEXANDRIA, VA |
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Oliff |
James |
A. |
OLIFF, PLC |
ALEXANDRIA, VA |
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America |
Bank |
OF |
Alston & Bird, LLP |
Charlotte, NC |
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End |
Vantage |
South |
Alston & Bird, LLP |
CHARLOTTE, NC |
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Saralino |
Mark |
D. |
Renner, Otto, Boisselle & Sklar, LLP |
Cleveland, OH |
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P.c. |
Sheridan |
Rross |
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DENVER, CO |
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Ross |
Pc |
Sheridan |
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Denver, CO |
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C |
Stewart |
Raymond |
Birch Stewart Kolasch & Birch, LLP |
Falls Church, VA |
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Kolash |
Birch |
Stewart |
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Falls Church, VA |
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Kolasch |
Joseph |
A. |
Birch Stewart Kolasch & Birch, LLP |
Falls Church, VA |
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Murphyjr |
Gerald |
M. |
Birch Stewart Kolasch & Birch, LLP |
Falls Church, VA |
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Bergman |
Jeffrey |
S. |
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HOUSTON, TX |
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Stull |
Andrea |
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Houston, TX |
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Bergman |
Mr. |
Jeffrey |
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Houston, TX |
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Batzli |
Brian |
H. |
Merchant & Gould, PC |
Minneapolis, MN |
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Hamre |
Curtis |
B. |
Hamre, Schumann, Mueller & Larson, PC |
MINNEAPOLIS, MN |
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Orkin. |
Russell |
D. |
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Pittsburgh, PA |
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Roup |
Posz |
Law |
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Reston, VA |
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Group |
Stevens |
Law |
1754 Technology Drive |
SAN JOSE, CA |
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Group |
Stevens |
Law |
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San Jose,, CA |
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Owens |
Jonathan |
O. |
Haverstock & Owens, LLP |
Sunnyvale, CA |
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Ruch |
Joseph |
J. |
Sughrue Mion, PLLC |
Washington, DC |
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B. |
Pllc |
Neil |
Sughrue Mion, PLLC |
WASHINGTON, DC |
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Jay |
Jeremy |
Mindlin |
Leydig Voit & Mayer, Ltd. |
Washington, DC |
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Group |
Intellectual |
Property |
Crowell & Moring LLP |
Washington, DC |
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MION |
SUGHRUE |
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WASHINGTON, DC |
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Horne |
Erroll |
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Crowell & Moring LLP |
Washington, DC |
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Graham |
Qiana |
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Crowell & Moring LLP |
Washington, DC |
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5/30/2024 |
Tanaka, Tatsuya |
Assignor |
Application
Publication |
18678873
20240401222 |
Workpiece Holding Jig
Workpiece Holding Jig |
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5/30/2024 |
Nishimoto, Kazuyoshi |
Assignor |
Application
Publication |
18678873
20240401222 |
Workpiece Holding Jig
Workpiece Holding Jig |
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5/30/2024 |
Nishinaka, Yutaka |
Assignor |
Application
Publication |
18678873
20240401222 |
Workpiece Holding Jig
Workpiece Holding Jig |
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5/30/2024 |
Tanaka, Tatsuya |
Assignor |
Application
Publication |
18678027
20240401221 |
Workpiece Holding Jig
Workpiece Holding Jig |
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5/30/2024 |
Nishimoto, Kazuyoshi |
Assignor |
Application
Publication |
18678027
20240401221 |
Workpiece Holding Jig
Workpiece Holding Jig |
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5/30/2024 |
Nishinaka, Yutaka |
Assignor |
Application
Publication |
18678027
20240401221 |
Workpiece Holding Jig
Workpiece Holding Jig |
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5/13/2024 |
Ishida, Tetsuji |
Assignor |
Application
Publication |
18636057
20240351943 |
Method Of Producing Plating Deposit
Method Of Producing Plating Deposit |
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5/13/2024 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication |
18636057
20240351943 |
Method Of Producing Plating Deposit
Method Of Producing Plating Deposit |
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5/13/2024 |
Komeda, Takuya |
Assignor |
Application
Publication |
18636057
20240351943 |
Method Of Producing Plating Deposit
Method Of Producing Plating Deposit |
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5/1/2024 |
Sato, Masaaki |
Assignor |
Application
Publication |
18644980
20240360586 |
Method And System For Regenerating Electrolytic Copper Plating Solution
Method And System For Regenerating Electrolytic Copper Plating Solution |
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5/1/2024 |
Tachibana, Shinji |
Assignor |
Application
Publication |
18644980
20240360586 |
Method And System For Regenerating Electrolytic Copper Plating Solution
Method And System For Regenerating Electrolytic Copper Plating Solution |
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5/1/2024 |
Oda, Yukinori |
Assignor |
Application
Publication |
18644980
20240360586 |
Method And System For Regenerating Electrolytic Copper Plating Solution
Method And System For Regenerating Electrolytic Copper Plating Solution |
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5/1/2024 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
18644980
20240360586 |
Method And System For Regenerating Electrolytic Copper Plating Solution
Method And System For Regenerating Electrolytic Copper Plating Solution |
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5/1/2024 |
Okamachi, Takuya |
Assignor |
Application
Publication |
18644980
20240360586 |
Method And System For Regenerating Electrolytic Copper Plating Solution
Method And System For Regenerating Electrolytic Copper Plating Solution |
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1/4/2024 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication |
18390421
20240200196 |
Catalyst Application Bath For Electroless Plating, Method Of Producing C...
Catalyst Application Bath For Electroless Plating, Method Of Producing C... |
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1/4/2024 |
Nakano, Naoki |
Assignor |
Application
Publication |
18390421
20240200196 |
Catalyst Application Bath For Electroless Plating, Method Of Producing C...
Catalyst Application Bath For Electroless Plating, Method Of Producing C... |
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1/4/2024 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
18390421
20240200196 |
Catalyst Application Bath For Electroless Plating, Method Of Producing C...
Catalyst Application Bath For Electroless Plating, Method Of Producing C... |
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1/4/2024 |
Odajima, Mai |
Assignor |
Application
Publication |
18390421
20240200196 |
Catalyst Application Bath For Electroless Plating, Method Of Producing C...
Catalyst Application Bath For Electroless Plating, Method Of Producing C... |
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12/13/2023 |
Oda, Yukinori |
Assignor |
Application
Publication |
18538789
20240218518 |
Electroless Ruthenium Plating Bath
Electroless Ruthenium Plating Bath |
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12/13/2023 |
Ii, Yoshihito |
Assignor |
Application
Publication |
18538789
20240218518 |
Electroless Ruthenium Plating Bath
Electroless Ruthenium Plating Bath |
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12/13/2023 |
Maruo, Yoichi |
Assignor |
Application
Publication |
18538789
20240218518 |
Electroless Ruthenium Plating Bath
Electroless Ruthenium Plating Bath |
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6/22/2023 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
18336944
20230407487 |
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy |
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6/22/2023 |
Maekawa, Takuma |
Assignor |
Application
Publication |
18336944
20230407487 |
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy |
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6/22/2023 |
Tanaka, Sayuri |
Assignor |
Application
Publication |
18336944
20230407487 |
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy |
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6/22/2023 |
Shibayama, Fuminori |
Assignor |
Application
Publication |
18336944
20230407487 |
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy
Etchant And Method Of Surface Treatment Of Aluminum Or Aluminum Alloy |
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1/31/2022 |
Ishida, Tetsuji |
Assignor |
Application
Publication |
17631837
20220275516 |
Pretreatment Method for Electroless Plating, and Pretreatment Solution f...
Pretreatment Method for Electroless Plating, and Pretreatment Solution f... |
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1/31/2022 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication |
17631837
20220275516 |
Pretreatment Method for Electroless Plating, and Pretreatment Solution f...
Pretreatment Method for Electroless Plating, and Pretreatment Solution f... |
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1/31/2022 |
Shimizu, Ryoyu |
Assignor |
Application
Publication |
17631837
20220275516 |
Pretreatment Method for Electroless Plating, and Pretreatment Solution f...
Pretreatment Method for Electroless Plating, and Pretreatment Solution f... |
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1/19/2022 |
Aisin Aw Company, Ltd. |
Assignor |
Application
Publication |
16968226
20210032756 |
Shaft Member And Manufacturing Method Of Shaft Member
Shaft Member And Manufacturing Method Of Shaft Member |
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7/27/2021 |
Shibata, Toshiaki |
Assignor |
Application
Publication |
17386222
20220033973 |
Electroless Palladium Plating Bath
Electroless Palladium Plating Bath |
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7/27/2021 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
17386222
20220033973 |
Electroless Palladium Plating Bath
Electroless Palladium Plating Bath |
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7/27/2021 |
Maekawa, Takuma |
Assignor |
Application
Publication |
17386222
20220033973 |
Electroless Palladium Plating Bath
Electroless Palladium Plating Bath |
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7/27/2021 |
Murakoshi, Masahiro |
Assignor |
Application
Publication |
17425145
20220119980 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/27/2021 |
Okuda, Tomoji |
Assignor |
Application
Publication |
17425145
20220119980 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/27/2021 |
Nishimoto, Kazuyoshi |
Assignor |
Application
Publication |
17425145
20220119980 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/23/2021 |
Murakoshi, Masahiro |
Assignor |
Application
Publication |
17424933
20220098750 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/23/2021 |
Okuda, Tomoji |
Assignor |
Application
Publication |
17424933
20220098750 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/23/2021 |
Nishimoto, Kazuyoshi |
Assignor |
Application
Publication |
17424933
20220098750 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/22/2021 |
Murakoshi, Masahiro |
Assignor |
Application
Publication |
17424941
20220098751 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/22/2021 |
Okuda, Tomoji |
Assignor |
Application
Publication |
17424941
20220098751 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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7/22/2021 |
Nishimoto, Kazuyoshi |
Assignor |
Application
Publication |
17424941
20220098751 |
Workpiece Holding Jig and Electroplating Apparatus
Workpiece Holding Jig and Electroplating Apparatus |
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3/31/2021 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication |
17219709
20210310127 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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3/31/2021 |
Kaneko, Yohei |
Assignor |
Application
Publication |
17219709
20210310127 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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3/31/2021 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
17219709
20210310127 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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3/31/2021 |
Oogami, Yuhei |
Assignor |
Application
Publication |
17219709
20210310127 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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3/31/2021 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication
Patent |
17219709
20210310127
11814717 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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3/31/2021 |
Kaneko, Yohei |
Assignor |
Application
Publication
Patent |
17219709
20210310127
11814717 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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3/31/2021 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication
Patent |
17219709
20210310127
11814717 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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3/31/2021 |
Oogami, Yuhei |
Assignor |
Application
Publication
Patent |
17219709
20210310127
11814717 |
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method
Palladium Plating Solution And Plating Method |
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12/21/2020 |
Takada, Hideaki |
Assignor |
Application
Publication |
17254741
20210262096 |
Electroless Copper Plating Bath
Electroless Copper Plating Bath |
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12/21/2020 |
Nakayama, Tomoharu |
Assignor |
Application
Publication |
17254741
20210262096 |
Electroless Copper Plating Bath
Electroless Copper Plating Bath |
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12/21/2020 |
Oda, Yukinori |
Assignor |
Application
Publication |
17254741
20210262096 |
Electroless Copper Plating Bath
Electroless Copper Plating Bath |
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12/21/2020 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication |
17254741
20210262096 |
Electroless Copper Plating Bath
Electroless Copper Plating Bath |
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10/5/2020 |
Okada, Akira |
Assignor |
Application
Publication |
17063256
20210102295 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
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10/5/2020 |
Kiso, Masayuki |
Assignor |
Application
Publication |
17063256
20210102295 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
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10/5/2020 |
Hashimoto, Daisuke |
Assignor |
Application
Publication |
17063256
20210102295 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
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10/5/2020 |
Taniguchi, Keita |
Assignor |
Application
Publication |
17063256
20210102295 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
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10/5/2020 |
Okuda, Tomoji |
Assignor |
Application
Publication |
17063256
20210102295 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
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10/5/2020 |
Matsuyama, Daisuke |
Assignor |
Application
Publication |
17063256
20210102295 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
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10/1/2020 |
Hashimoto, Daisuke |
Assignor |
Application
Publication |
17060375
20210102306 |
Holding Apparatus
Holding Apparatus |
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10/1/2020 |
Okuda, Tomoji |
Assignor |
Application
Publication |
17060375
20210102306 |
Holding Apparatus
Holding Apparatus |
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10/1/2020 |
Nishimoto, Kazuyoshi |
Assignor |
Application
Publication |
17060375
20210102306 |
Holding Apparatus
Holding Apparatus |
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10/1/2020 |
Matsuyama, Daisuke |
Assignor |
Application
Publication |
17060375
20210102306 |
Holding Apparatus
Holding Apparatus |
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8/11/2020 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
16968981
20210054508 |
Electroless Palladium Plating Solution And Palladium Film
Electroless Palladium Plating Solution And Palladium Film |
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8/11/2020 |
Sasamura, Tetsuya |
Assignor |
Application
Publication |
16968981
20210054508 |
Electroless Palladium Plating Solution And Palladium Film
Electroless Palladium Plating Solution And Palladium Film |
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8/11/2020 |
Someya, Tatsushi |
Assignor |
Application
Publication |
16968981
20210054508 |
Electroless Palladium Plating Solution And Palladium Film
Electroless Palladium Plating Solution And Palladium Film |
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8/11/2020 |
Furuya, Eriko |
Assignor |
Application
Publication |
16968981
20210054508 |
Electroless Palladium Plating Solution And Palladium Film
Electroless Palladium Plating Solution And Palladium Film |
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8/11/2020 |
Wada, Shinsuke |
Assignor |
Application
Publication |
16968981
20210054508 |
Electroless Palladium Plating Solution And Palladium Film
Electroless Palladium Plating Solution And Palladium Film |
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8/7/2020 |
Matsumoto, Osamu |
Assignor |
Application
Publication |
16968226
20210032756 |
Shaft Member And Manufacturing Method Of Shaft Member
Shaft Member And Manufacturing Method Of Shaft Member |
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8/7/2020 |
Mori, Takahiro |
Assignor |
Application
Publication |
16968226
20210032756 |
Shaft Member And Manufacturing Method Of Shaft Member
Shaft Member And Manufacturing Method Of Shaft Member |
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8/7/2020 |
Kita, Akihiko |
Assignor |
Application
Publication |
16968226
20210032756 |
Shaft Member And Manufacturing Method Of Shaft Member
Shaft Member And Manufacturing Method Of Shaft Member |
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8/7/2020 |
Ozawa, Seiya |
Assignor |
Application
Publication |
16968226
20210032756 |
Shaft Member And Manufacturing Method Of Shaft Member
Shaft Member And Manufacturing Method Of Shaft Member |
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8/7/2020 |
Iguchi, Shoji |
Assignor |
Application
Publication |
16968226
20210032756 |
Shaft Member And Manufacturing Method Of Shaft Member
Shaft Member And Manufacturing Method Of Shaft Member |
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5/22/2020 |
Naka, Nobuhiko |
Assignor |
Application
Publication |
16881427
20200378008 |
Method For Producing A Printed Wiring Board
Method For Producing A Printed Wiring Board |
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5/22/2020 |
Saijo, Yoshikazu |
Assignor |
Application
Publication |
16881427
20200378008 |
Method For Producing A Printed Wiring Board
Method For Producing A Printed Wiring Board |
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5/22/2020 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication |
16881427
20200378008 |
Method For Producing A Printed Wiring Board
Method For Producing A Printed Wiring Board |
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5/19/2020 |
Okuda, Tomoji |
Assignor |
Application
Publication |
16758490
20200248331 |
Workpiece Holding Jig and Loading and Unloading Apparatus
Workpiece Holding Jig and Loading and Unloading Apparatus |
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4/9/2020 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication |
16844647
20200340120 |
Gold Plating Method And Plating Film
Gold Plating Method And Plating Film |
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4/9/2020 |
Kaneko, Yohei |
Assignor |
Application
Publication |
16844647
20200340120 |
Gold Plating Method And Plating Film
Gold Plating Method And Plating Film |
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4/9/2020 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
16844647
20200340120 |
Gold Plating Method And Plating Film
Gold Plating Method And Plating Film |
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4/9/2020 |
Nishimura, Naoshi |
Assignor |
Application
Publication |
16844647
20200340120 |
Gold Plating Method And Plating Film
Gold Plating Method And Plating Film |
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4/3/2020 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication |
16753395
20200318239 |
Electroless Palladium Plating Solution
Electroless Palladium Plating Solution |
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4/3/2020 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
16753395
20200318239 |
Electroless Palladium Plating Solution
Electroless Palladium Plating Solution |
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4/3/2020 |
Kawahara, Tomohiro |
Assignor |
Application
Publication |
16753395
20200318239 |
Electroless Palladium Plating Solution
Electroless Palladium Plating Solution |
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4/3/2020 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication |
16753417
20200248312 |
Electroless Palladium Plating Solution, And Electroless Palladium Plated...
Electroless Palladium Plating Solution, And Electroless Palladium Plated... |
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4/3/2020 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
16753417
20200248312 |
Electroless Palladium Plating Solution, And Electroless Palladium Plated...
Electroless Palladium Plating Solution, And Electroless Palladium Plated... |
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4/3/2020 |
Wada, Shinsuke |
Assignor |
Application
Publication |
16753417
20200248312 |
Electroless Palladium Plating Solution, And Electroless Palladium Plated...
Electroless Palladium Plating Solution, And Electroless Palladium Plated... |
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3/17/2020 |
Tachibana, Shinji |
Assignor |
Application
Publication |
16648086
20200276608 |
Surface Treatment Apparatus And Surface Treatment Method
Surface Treatment Apparatus And Surface Treatment Method |
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3/17/2020 |
Okuda, Tomoji |
Assignor |
Application
Publication |
16648086
20200276608 |
Surface Treatment Apparatus And Surface Treatment Method
Surface Treatment Apparatus And Surface Treatment Method |
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3/17/2020 |
Utsumi, Masayuki |
Assignor |
Application
Publication |
16648086
20200276608 |
Surface Treatment Apparatus And Surface Treatment Method
Surface Treatment Apparatus And Surface Treatment Method |
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3/17/2020 |
Matsuyama, Daisuke |
Assignor |
Application
Publication |
16648086
20200276608 |
Surface Treatment Apparatus And Surface Treatment Method
Surface Treatment Apparatus And Surface Treatment Method |
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3/2/2020 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication |
16806328
20200283906 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
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3/2/2020 |
Kaneko, Yohei |
Assignor |
Application
Publication |
16806328
20200283906 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
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|
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3/2/2020 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication |
16806328
20200283906 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
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|
3/2/2020 |
Nishimura, Naoshi |
Assignor |
Application
Publication |
16806328
20200283906 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
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|
|
3/2/2020 |
Maeda, Tsuyoshi |
Assignor |
Application
Publication
Patent |
16806328
20200283906
10975475 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
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|
|
3/2/2020 |
Kaneko, Yohei |
Assignor |
Application
Publication
Patent |
16806328
20200283906
10975475 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
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|
|
3/2/2020 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication
Patent |
16806328
20200283906
10975475 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
|
|
|
3/2/2020 |
Nishimura, Naoshi |
Assignor |
Application
Publication
Patent |
16806328
20200283906
10975475 |
Electroless Gold Plating Bath
Electroless Gold Plating Bath
Electroless Gold Plating Bath |
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|
|
2/3/2020 |
Ishimaru, Shinji |
Assignor |
Application
Publication |
16636314
20210164925 |
Integrated Unicellular/Filamentous Algal Production, Harvesting and Reme...
Integrated Unicellular/Filamentous Algal Production, Harvesting and Reme... |
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1/31/2020 |
Oda, Yukinori |
Assignor |
Application
Publication |
16779415
20200205298 |
Heat-resistant Power Module Substrate, Heat-resistant Plating Film And P...
Heat-resistant Power Module Substrate, Heat-resistant Plating Film And P... |
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1/31/2020 |
Kurosaka, Seigo |
Assignor |
Application
Publication |
16779415
20200205298 |
Heat-resistant Power Module Substrate, Heat-resistant Plating Film And P...
Heat-resistant Power Module Substrate, Heat-resistant Plating Film And P... |
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12/26/2019 |
Takeuchi, Masaharu |
Assignor |
Application
Publication |
16727302
20200224314 |
Surface Treating Apparatus And Surface Treatment Method
Surface Treating Apparatus And Surface Treatment Method |
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|
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12/26/2019 |
Utsumi, Masayuki |
Assignor |
Application
Publication |
16727302
20200224314 |
Surface Treating Apparatus And Surface Treatment Method
Surface Treating Apparatus And Surface Treatment Method |
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|
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12/26/2019 |
Takeuchi, Masaharu |
Assignor |
Application
Publication |
16727390
20200224315 |
Surface Treating Apparatus
Surface Treating Apparatus |
|
|
|
12/26/2019 |
Utsumi, Masayuki |
Assignor |
Application
Publication |
16727390
20200224315 |
Surface Treating Apparatus
Surface Treating Apparatus |
|
|
|
12/26/2019 |
Takeuchi, Masaharu |
Assignor |
Application
Publication
Patent |
16727302
20200224314
10995407 |
Surface Treating Apparatus And Surface Treatment Method
Surface Treating Apparatus And Surface Treatment Method
Surface Treating Apparatus And Surface Treatment Method |
|
|
|
12/26/2019 |
Utsumi, Masayuki |
Assignor |
Application
Publication
Patent |
16727302
20200224314
10995407 |
Surface Treating Apparatus And Surface Treatment Method
Surface Treating Apparatus And Surface Treatment Method
Surface Treating Apparatus And Surface Treatment Method |
|
|
|
12/26/2019 |
Takeuchi, Masaharu |
Assignor |
Application
Publication
Patent |
16727390
20200224315
11001928 |
Surface Treating Apparatus
Surface Treating Apparatus
Surface Treating Apparatus |
|
|
|
12/26/2019 |
Utsumi, Masayuki |
Assignor |
Application
Publication
Patent |
16727390
20200224315
11001928 |
Surface Treating Apparatus
Surface Treating Apparatus
Surface Treating Apparatus |
|
|
|
11/20/2019 |
Shibata, Toshiaki |
Assignor |
Application
Patent |
16689267
10947623 |
Electroless Plating Bath
Electroless Plating Bath |
|
|
|
11/20/2019 |
Oda, Yukinori |
Assignor |
Application
Patent |
16689267
10947623 |
Electroless Plating Bath
Electroless Plating Bath |
|
|
|
11/20/2019 |
Maekawa, Takuma |
Assignor |
Application
Patent |
16689267
10947623 |
Electroless Plating Bath
Electroless Plating Bath |
|
|
|
11/14/2019 |
Hashimoto, Daisuke |
Assignor |
Application
Publication |
16683699
20200168499 |
Holding Jig
Holding Jig |
|
|
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11/14/2019 |
Okuda, Tomoji |
Assignor |
Application
Publication |
16683699
20200168499 |
Holding Jig
Holding Jig |
|
|
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11/14/2019 |
Nishimoto, Kazuyoshi |
Assignor |
Application
Publication |
16683699
20200168499 |
Holding Jig
Holding Jig |
|
|
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11/14/2019 |
Matsuyama, Daisuke |
Assignor |
Application
Publication |
16683699
20200168499 |
Holding Jig
Holding Jig |
|
|
|
9/24/2019 |
Kiso, Masayuki |
Assignor |
Application
Publication |
16581080
20200123673 |
Electrolytic Tin Alloy Plating Solution
Electrolytic Tin Alloy Plating Solution |
|
|
|
9/24/2019 |
Enomoto, Masato |
Assignor |
Application
Publication |
16581080
20200123673 |
Electrolytic Tin Alloy Plating Solution
Electrolytic Tin Alloy Plating Solution |
|
|
|
9/24/2019 |
Hashimoto, Daisuke |
Assignor |
Application
Publication |
16581080
20200123673 |
Electrolytic Tin Alloy Plating Solution
Electrolytic Tin Alloy Plating Solution |
|
|
|
9/24/2019 |
Kawahara, Tomohiro |
Assignor |
Application
Publication |
16581080
20200123673 |
Electrolytic Tin Alloy Plating Solution
Electrolytic Tin Alloy Plating Solution |
|
|
|
9/5/2019 |
Okada, Akira |
Assignor |
Application
Publication |
16561407
20200095698 |
Electrolytic Tin Plating Solution
Electrolytic Tin Plating Solution |
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|
|
9/5/2019 |
Kiso, Masayuki |
Assignor |
Application
Publication |
16561407
20200095698 |
Electrolytic Tin Plating Solution
Electrolytic Tin Plating Solution |
|
|
|
9/5/2019 |
Hashimoto, Daisuke |
Assignor |
Application
Publication |
16561407
20200095698 |
Electrolytic Tin Plating Solution
Electrolytic Tin Plating Solution |
|
|
|
9/5/2019 |
Taniguchi, Keita |
Assignor |
Application
Publication |
16561407
20200095698 |
Electrolytic Tin Plating Solution
Electrolytic Tin Plating Solution |
|
|
|
7/8/2019 |
Nakayama, Tomoharu |
Assignor |
Application
Publication |
15464175
20170268119 |
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method |
|
|
|
7/8/2019 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication |
15464175
20170268119 |
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method |
|
|
|
7/8/2019 |
Yoshioka, Yuko |
Assignor |
Application
Publication |
15464175
20170268119 |
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method |
|
|
|
7/8/2019 |
Nakayama, Tomoharu |
Assignor |
Application
Publication
Patent |
15464175
20170268119
10450666 |
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method |
|
|
|
7/8/2019 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication
Patent |
15464175
20170268119
10450666 |
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method |
|
|
|
7/8/2019 |
Yoshioka, Yuko |
Assignor |
Application
Publication
Patent |
15464175
20170268119
10450666 |
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method
Copper Plating Solution And Copper Plating Method |
|
|
|
7/5/2019 |
Shibata, Toshiaki |
Assignor |
Application
Publication |
16503785
20200020660 |
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH |
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|
|
7/5/2019 |
Kanzaki, Sho |
Assignor |
Application
Publication |
16503785
20200020660 |
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH |
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|
|
7/5/2019 |
Oda, Yukinori |
Assignor |
Application
Publication |
16503785
20200020660 |
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH |
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|
|
7/5/2019 |
Maekawa, Takuma |
Assignor |
Application
Publication |
16503785
20200020660 |
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH |
|
|
|
7/5/2019 |
Ii, Yoshito |
Assignor |
Application
Publication |
16503785
20200020660 |
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH |
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|
|
5/8/2019 |
Naka, Nobuhiko |
Assignor |
Application
Publication |
16348296
20210289637 |
Method For Producing Printed Wiring Board
Method For Producing Printed Wiring Board |
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|
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5/8/2019 |
Saijo, Yoshikazu |
Assignor |
Application
Publication |
16348296
20210289637 |
Method For Producing Printed Wiring Board
Method For Producing Printed Wiring Board |
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|
|
5/8/2019 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication |
16348296
20210289637 |
Method For Producing Printed Wiring Board
Method For Producing Printed Wiring Board |
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|
|
3/28/2019 |
Okada, Akira |
Assignor |
Application
Publication |
16368225
20190309435 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
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|
|
3/28/2019 |
Kiso, Masayuki |
Assignor |
Application
Publication |
16368225
20190309435 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
|
|
|
3/28/2019 |
Hashimoto, Daisuke |
Assignor |
Application
Publication |
16368225
20190309435 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
|
|
|
3/28/2019 |
Taniguchi, Keita |
Assignor |
Application
Publication |
16368225
20190309435 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
|
|
|
3/28/2019 |
Okuda, Tomoji |
Assignor |
Application
Publication |
16368225
20190309435 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
|
|
|
3/28/2019 |
Matsuyama, Daisuke |
Assignor |
Application
Publication |
16368225
20190309435 |
Surface Treatment Device, Surface Treatment Method And Paddle
Surface Treatment Device, Surface Treatment Method And Paddle |
|
|
|
2/25/2019 |
Sakuma, Yuichi |
Assignor |
Application
Publication
Patent |
16284503
20190198441
10763204 |
Semiconductor Device
Semiconductor Device
Semiconductor Device |
|
|
|
2/25/2019 |
Sugiura, Kazuhiko |
Assignor |
Application
Publication
Patent |
16284503
20190198441
10763204 |
Semiconductor Device
Semiconductor Device
Semiconductor Device |
|
|
|
2/25/2019 |
Miwa, Kazuhiro |
Assignor |
Application
Publication
Patent |
16284503
20190198441
10763204 |
Semiconductor Device
Semiconductor Device
Semiconductor Device |
|
|
|
2/25/2019 |
Oda, Yukinori |
Assignor |
Application
Publication
Patent |
16284503
20190198441
10763204 |
Semiconductor Device
Semiconductor Device
Semiconductor Device |
|
|
|
2/25/2019 |
Kurosaka, Seigo |
Assignor |
Application
Publication
Patent |
16284503
20190198441
10763204 |
Semiconductor Device
Semiconductor Device
Semiconductor Device |
|
|
|
2/25/2019 |
Iwashige, Tomohito |
Assignor |
Application
Publication
Patent |
16284503
20190198441
10763204 |
Semiconductor Device
Semiconductor Device
Semiconductor Device |
|
|
|
1/21/2019 |
Hotta, Teruyuki |
Assignor |
Application
Publication |
16252903
20190301048 |
Surface Treating Device
Surface Treating Device |
|
|
|
1/21/2019 |
Shimizu, Kouji |
Assignor |
Application
Publication |
16252903
20190301048 |
Surface Treating Device
Surface Treating Device |
|
|
|
1/21/2019 |
Utsumi, Masayuki |
Assignor |
Application
Publication |
16252903
20190301048 |
Surface Treating Device
Surface Treating Device |
|
|
|
1/21/2019 |
Aratani, Masato |
Assignor |
Application
Publication |
16252903
20190301048 |
Surface Treating Device
Surface Treating Device |
|
|
|
1/21/2019 |
Hotta, Teruyuki |
Assignor |
Application
Publication
Patent |
16252903
20190301048
11001936 |
Surface Treating Device
Surface Treating Device
Surface Treating Device |
|
|
|
1/21/2019 |
Shimizu, Kouji |
Assignor |
Application
Publication
Patent |
16252903
20190301048
11001936 |
Surface Treating Device
Surface Treating Device
Surface Treating Device |
|
|
|
1/21/2019 |
Utsumi, Masayuki |
Assignor |
Application
Publication
Patent |
16252903
20190301048
11001936 |
Surface Treating Device
Surface Treating Device
Surface Treating Device |
|
|
|
1/21/2019 |
Aratani, Masato |
Assignor |
Application
Publication
Patent |
16252903
20190301048
11001936 |
Surface Treating Device
Surface Treating Device
Surface Treating Device |
|
|
|
1/16/2019 |
Naka, Nobuhiko |
Assignor |
Application
Publication |
16318253
20190264329 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Saijo, Yoshikazu |
Assignor |
Application
Publication |
16318253
20190264329 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication |
16318253
20190264329 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Naka, Nobuhiko |
Assignor |
Application
Publication
Patent |
16318253
20190264329
10858739 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Saijo, Yoshikazu |
Assignor |
Application
Publication
Patent |
16318253
20190264329
10858739 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication
Patent |
16318253
20190264329
10858739 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Naka, Nobuhiko |
Assignor |
Application
Publication
Patent |
16318253
20190264329
10927463 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Saijo, Yoshikazu |
Assignor |
Application
Publication
Patent |
16318253
20190264329
10927463 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/16/2019 |
Yamamoto, Hisamitsu |
Assignor |
Application
Publication
Patent |
16318253
20190264329
10927463 |
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T...
Pretreating Liquid For Electroless Plating To Be Used During Reduction T... |
|
|
|
1/3/2019 |
Tanabe, Katsuhisa |
Assignor |
Application
Publication
Patent |
16314844
20190309423
10822704 |
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath |
|
|
|
1/3/2019 |
Okubo, Hiroki |
Assignor |
Application
Publication
Patent |
16314844
20190309423
10822704 |
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath |
|
|
|
1/3/2019 |
Sasamura, Tetsuya |
Assignor |
Application
Publication
Patent |
16314844
20190309423
10822704 |
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath |
|
|
|
1/3/2019 |
Someya, Tatsushi |
Assignor |
Application
Publication
Patent |
16314844
20190309423
10822704 |
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath |
|
|
|
1/3/2019 |
Furuya, Eriko |
Assignor |
Application
Publication
Patent |
16314844
20190309423
10822704 |
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath
Electroless Platinum Plating Bath |
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Incoming Payments
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Date Filed
Location
