Chen, Chien-hua

Chen, Chien-hua

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	Date Filed	Venue	Case Number	Title	Party Type
	3/8/2004	United States Patent and Trademark Office	10796700	Method For Operating Chemical Mechanical Polishing ("cmp") T...	Applicant

1 Row Total

Outside Counsel (184)

	Last Name	First Name	Middle Name	Firm	Location
	Absher	Alton	L.	Kilpatrick Townsend & Stockton, LLP	Winston-salem, Nc,
	Adams	Scott		Davis Wright Tremaine LLP
	Albert	Philip		Union Bank Bldg
	Alemanni	John	C.	Kilpatrick Townsend & Stockton, LLP	Winston-salem, Nc,
	Allen	Kenneth		Steuart St., Tower, One Market Plaza San Fra...	Virginia Beach, VA
	Aly	Amr	O.	Kilpatrick Townsend & Stockton, LLP	Ny 10036,
	Amanat	Houtan		Kilpatrick Townsend & Stockton, LLP
	Annis	David		Sharp Kabushiki Kaisha
	Apple	Randolph	Ted	Kilpatrick Townsend & Stockton, LLP
	Artuz	Robert		Sharp Kabushiki Kaisha
	Auchterlonie	Thomas		Kilpatrick Townsend & Stockton, LLP
	Balun	Matthew		Sharp Kabushiki Kaisha
	Barrish	Mark		Sharp Kabushiki Kaisha
	Basarkar	Girish		Sharp Kabushiki Kaisha
	Bastian	Kevin		Sharp Kabushiki Kaisha
	Belagodu	Akarsh	P.	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Bennett	Jesse		Kilpatrick Townsend & Stockton, LLP
	Bergstrom	James		Sharp Kabushiki Kaisha
	Bernard	Eugene		Sharp Kabushiki Kaisha
	Bertelson	Michael		Digeo, Inc.
	Blackburn	Jennifer		Sharp Kabushiki Kaisha
	Blake	Vanessa		Sharp Kabushiki Kaisha
	Boring	Landin		Kilpatrick Townsend & Stockton, LLP	Seattle, WA
	Bowers	Carl		Kilpatrick Townsend & Stockton, LLP
	Boyd	David		Sharp Kabushiki Kaisha
	Britt	Juliene		Perkins Coie LLP	SEATTLE, WA
	Brown	Kyle		Kilpatrick Townsend & Stockton, LLP
	Brown	Theodore		Kilpatrick Townsend & Stockton, LLP
	Bussey	Megan		Sharp Kabushiki Kaisha
	Calkins	Charles		OFFICE, CHIEF OF ENGINEERS
	Cassell	Nathan		Sharp Kabushiki Kaisha
	Caswell	Deborah		Glenn Patent Group
	Catmull	Kelvin		Kilpatrick Townsend & Stockton, LLP
	CHANG	KO-FANG		Kilpatrick Townsend & Stockton, LLP
	Chang	Shin-Tsen		Electronic Arts, Inc.
	Choi	Wendy		Kilpatrick Townsend & Stockton, LLP
	Colwell	Robert		PAUL J. WINTERS
	Cook	Roger		Christensen O'Connor Johnson Kindness PLLC
	Cosenza	Martin II		Hauptman Ham, LLP
	Crall	Kristin	Mallatt	Kilpatrick Townsend & Stockton, LLP	Palm City, FL
	Cretsinger	Cathy		Sharp Kabushiki Kaisha
	Curylo	Robert	J.	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Dailey	Robert		Sharp Kabushiki Kaisha
	Daley	William		Sharp Kabushiki Kaisha
	Dimino	Michael		Reveo, Inc.
	Dodson	Richard		Kilpatrick Townsend & Stockton, LLP
	Doyle	Kristin		Sharp Kabushiki Kaisha
	Durkee	Christopher	M.	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Ellenberger	Ernest		Baker Donelson Bearman Caldwell & Berkowitz,...
	Eng	Hugo		Hoffman-La Roche, Inc.
	Eurek	Justin		Kilpatrick Townsend & Stockton, LLP
	Ewing	James	Lindsay	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Ferrario	Matias		Sharp Kabushiki Kaisha
	Flanagan	Lisa		Sharp Kabushiki Kaisha
	Foster	Bryan		Sharp Kabushiki Kaisha
	Franklin	Thomas		Sharp Kabushiki Kaisha
	Gao	Chuan		Kilpatrick Townsend & Stockton, LLP	San Francisco, CA
	Gardner	Jason		Sharp Kabushiki Kaisha
	Gardner	John	Steven	Kilpatrick Townsend & Stockton, LLP	WINSTON-SALEM, NC
	Garrett-Wackowski	Euginia		Kilpatrick Townsend & Stockton, LLP
	Gaudry	Katherine		Sharp Kabushiki Kaisha
	Gavin	Geoffrey		Sharp Kabushiki Kaisha
	Gee	Tyler		Kilpatrick Townsend & Stockton, LLP
	Ghazanfari	Faryar		Kilpatrick Townsend & Stockton, LLP
	Gibby	Darin		Sharp Kabushiki Kaisha
	Giordano-Coltart	Jennifer		Kilpatrick Townsend & Stockton, LLP
	Golladay	James II		Kilpatrick Townsend & Stockton, LLP	Ca,
	Grab	Leslie		Sharp Kabushiki Kaisha
	Graham	Jamie	L.	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Grant	Bonnie		Sharp Kabushiki Kaisha
	Gray	Charles		Sharp Kabushiki Kaisha
	Gressler	Donna		Foley & Lardner, LLP
	Hall	David		Spensley Horn Jubas & Lubitz
	Hao	Joe		Sharp Kabushiki Kaisha
	Harris	Tywanda	L.	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Hart	Catherine		Sharp Kabushiki Kaisha
	Haughey	Paul		National Semiconductor Corporation
	Heines	M		HARRY A. PACINI
	Henderson	Mymy		Kilpatrick Townsend & Stockton, LLP
	Hetzer-Egger	Claudia		Sharp Kabushiki Kaisha
	Hinsch	Matthew		Sharp Kabushiki Kaisha
	Hokamura	Aaron		Kilpatrick Townsend & Stockton, LLP
	Holloway	David		Sharp Kabushiki Kaisha
	Holmes	Brenda		Sharp Kabushiki Kaisha
	Holt	Benjamin		Kilpatrick Townsend & Stockton, LLP
	Hopkins	Mark		Sharp Kabushiki Kaisha
	Howard	James		Kilpatrick Townsend & Stockton, LLP
	Hsueh	Hain-Whei		Kilpatrick Townsend & Stockton, LLP
	Hutchins	Eric	M.	Kilpatrick Townsend & Stockton, LLP	Ca,
	Hylton	Roger		Kilpatrick Townsend & Stockton, LLP
	Jenkins	Kenneth		Sharp Kabushiki Kaisha
	Jensen	Philip		Kilpatrick Townsend & Stockton, LLP
	Jewett	Stephen		Teradata Corporation
	Jewik	Patrick		Sharp Kabushiki Kaisha
	Johns	Athena		Sharp Kabushiki Kaisha
	Johns	Carol		Sharp Kabushiki Kaisha
	Joswick	Eugene	B.	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Kadaba	Vaibhav		Sharp Kabushiki Kaisha
	KAO	DAH-BIN		Kilpatrick Townsend & Stockton, LLP
	Kapur	Rajit		Accenture Global Services Ltd.

184 Rows Total	Page 1 of 2 | Go To

Chen, Chien-hua has not filed any forms with the United States Securities and Exchange Commission.

	Date Recorded	Party	Role	Document Type	Document No.	Invention Title
	2/5/2025	Hewlett-packard Development Company, LP	Assignee	Application Publication	18102412 20230173495	Microfluidic Devices Microfluidic Devices
	2/5/2025	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	18102412 20230173495 12263484	Microfluidic Devices Microfluidic Devices Microfluidic Devices
	12/19/2023	Mediatek Singapore Pte. Ltd.	Assignee	Application Publication	18544603 20240214852	Cross-link Interference (cli) Measurement And Reporting Cross-link Interference (cli) Measurement And Reporting
	10/27/2023	Hewlett-packard Development Company, LP	Assignee	Application Publication	18557567 20240216912	Microfluidic Device Microfluidic Device
	8/23/2023	Hewlett-packard Development Company, LP	Assignee	Application Publication	18454771 20230391086	Molded Structures With Channels Molded Structures With Channels
	1/28/2023	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	18098094 20230150199 12233598	Processes For Formation Of Molded Panels By Bringing Release Liner Of Mo... Processes For Formation Of Molded Panels By Bringing Release Liner Of Mo... Processes For Formation Of Molded Panels By Bringing Release Liner Of Mo...
	10/27/2022	Hewlett-packard Development Company, LP	Assignee	Application Publication	17974743 20230050391	Thermally Controlled Reagent Release Thermally Controlled Reagent Release
	7/21/2022	Hewlett-packard Development Company, LP	Assignee	Application Publication	17699050 20220203696	Fluid Circulation And Ejection Fluid Circulation And Ejection
	5/20/2022	Hewlett-packard Development Company, LP	Assignee	Application Publication	17778517 20220410163	Array Droplet Manipulations Array Droplet Manipulations
	3/9/2022	Arris Enterprises LLC	Assignee	Application Publication	17582444 20220239632	Load Balancing And Secure Tunneling For Cloud-based Network Controllers Load Balancing And Secure Tunneling For Cloud-based Network Controllers
	3/9/2022	Arris Enterprises LLC	Assignee	Application Publication Patent	17582444 20220239632 12058207	Load Balancing And Secure Tunneling For Cloud-based Network Controllers Load Balancing And Secure Tunneling For Cloud-based Network Controllers Load Balancing And Secure Tunneling For Cloud-based Network Controllers
	12/23/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17560994 20220111645	Fluid Propelling Apparatus Including A Heat Sink Fluid Propelling Apparatus Including A Heat Sink
	12/20/2021	Godex International Company, Ltd.	Assignee	Application Publication	16706808 20210070490	Device and Method of Test Tube Preparation Device and Method of Test Tube Preparation
	10/12/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	16076553 20210197199	Microfluidic Device Channel Layer Microfluidic Device Channel Layer
	10/1/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	16770805 20210252871	Fluid Property Sensor Fluid Property Sensor
	9/22/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	17482309 20220002149 11807523	Three-dimensional Features Formed In Molded Panel Three-dimensional Features Formed In Molded Panel Three-dimensional Features Formed In Molded Panel
	6/10/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17312743 20220126577	Molded Structures With Channels Molded Structures With Channels
	6/9/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17312360 20220111647	Molded Structures With Channels Molded Structures With Channels
	6/9/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	17312360 20220111647 11780227	Molded Structures With Channels Molded Structures With Channels Molded Structures With Channels
	6/7/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17340570 20210291547	Fluidic Ejection Dies With Enclosed Cross-channels Fluidic Ejection Dies With Enclosed Cross-channels
	6/7/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17311593 20220072858	Fluid Ejection Device With Break(s) In Cover Layer Fluid Ejection Device With Break(s) In Cover Layer
	6/7/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	17340570 20210291547 11654680	Fluidic Ejection Dies With Enclosed Cross-channels Fluidic Ejection Dies With Enclosed Cross-channels Fluidic Ejection Dies With Enclosed Cross-channels
	5/27/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17297612 20220009231	Applying Mold Chase Structure To End Portion Of Fluid Ejection Die Applying Mold Chase Structure To End Portion Of Fluid Ejection Die
	5/27/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17297718 20220105725	Fluid Ejection Polymeric Recirculation Channel Fluid Ejection Polymeric Recirculation Channel
	5/27/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	17297612 20220009231 11827021	Applying Mold Chase Structure To End Portion Of Fluid Ejection Die Applying Mold Chase Structure To End Portion Of Fluid Ejection Die Applying Mold Chase Structure To End Portion Of Fluid Ejection Die
	4/14/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17230053 20210276332	Fluid Ejection Devices Fluid Ejection Devices
	4/14/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	17230053 20210276332 11780226	Fluid Ejection Devices Fluid Ejection Devices Fluid Ejection Devices
	3/17/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	17276971 20220032626	Curved Fluid Ejection Devices Curved Fluid Ejection Devices
	1/29/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	16630020 20200164647	Fluidic Ejection Dies With Enclosed Cross-channels Fluidic Ejection Dies With Enclosed Cross-channels
	1/29/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	16629366 20210129534	Fluidic Ejection Dies With Enclosed Cross-channels Fluidic Ejection Dies With Enclosed Cross-channels
	1/29/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	16630020 20200164647 11155086	Fluidic Ejection Dies With Enclosed Cross-channels Fluidic Ejection Devices With Enclosed Cross-channels Fluidic Ejection Dies With Enclosed Cross-channels
	1/28/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	16629142 20200223226	Fluid Ejection Die Interlocked With Molded Body Fluid Ejection Die Interlocked With Molded Body
	1/21/2021	Hewlett-packard Development Company, LP	Assignee	Application Publication	16991524 20200369031	Molded Printhead Molded Printhead
	12/14/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17251856 20210252859	Carriers Including Fluid Ejection Dies Carriers Including Fluid Ejection Dies
	12/14/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17251967 20210347169	Fluidic Device With Nozzle Layer Conductors Fluidic Device With Nozzle Layer Conductors
	12/14/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17251982 20210347171	Fluidic Die With Nozzle Layer Electrode For Fluid Control Fluidic Die With Nozzle Layer Electrode For Fluid Control
	12/11/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17251238 20210245496	Fluidic Device With Nozzle Layer Having Conductive Trace For Damage Dete... Fluidic Device With Nozzle Layer Having Conductive Trace For Damage Dete...
	12/11/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17251263 20210323312	Fluidic Die Assemblies With Rigid Bent Substrates Fluidic Die Assemblies With Rigid Bent Substrates
	12/11/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	17251263 20210323312 11548287	Fluidic Die Assemblies With Rigid Bent Substrates Fluidic Die Assemblies With Rigid Bent Substrates Fluidic Die Assemblies With Rigid Bent Substrates
	11/25/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17058690 20210370668	Fluidic Die With Surface Condition Monitoring Fluidic Die With Surface Condition Monitoring
	11/25/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	17058690 20210370668 11559987	Fluidic Die With Surface Condition Monitoring Fluidic Die With Surface Condition Monitoring Fluidic Die With Surface Condition Monitoring
	11/23/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17083156 20210039390	Print Head Interposers Print Head Interposers
	11/12/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	16634926 20200238699	Fluidic Dies Fluidic Dies
	10/22/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	17049761 20210245151	Dual Direction Dispensers Dual Direction Dispensers
	8/4/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	16770805 20210252871	Fluid Property Sensor Fluid Property Sensor
	7/2/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	16920313 20200331272	Fluid Flow Structure Forming Method Fluid Flow Structure Forming Method
	7/2/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	16920313 20200331272 10994539	Fluid Flow Structure Forming Method Fluid Flow Structure Forming Method Fluid Flow Structure Forming Method
	6/30/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	16916520 20200331264	Fluid Ejection Device Including Fluid Output Channel Fluid Ejection Device Including Fluid Output Channel
	6/26/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication	16958607 20210252858	Conductive Elements Electrically Coupled To Fluidic Dies Conductive Elements Electrically Coupled To Fluidic Dies
	6/26/2020	Hewlett-packard Development Company, LP	Assignee	Application Publication Patent	16958607 20210252858 11433670	Conductive Elements Electrically Coupled To Fluidic Dies Conductive Elements Electrically Coupled To Fluidic Dies Conductive Elements Electrically Coupled To Fluidic Dies

50 Rows Total

Chen, Chien-hua has not been involved in any trademark assignment transactions in the PlainSite database.

Incoming Payments

This individual has not disclosed any incoming payments from lobbying groups.

Outgoing Payments

This individual has not disclosed any outgoing payments to lobbying groups.