Dean, Nancy F.
United States
No tags have been applied so far. Sign in to add some.
Dean, Nancy F.
Profile
Timeline
Documents (0)
Litigation (2)
Over Time
Attorneys (54)
Stock Market (0)
Related (0)
Patent Assignments (7)
Trademark Assignments (0)
Payments (0)
Federal Dockets
2
Active
1999–2006
Patent Assignments
7
On PlainSite Chat
No one has posted about Dean, Nancy F. yet.
Share something about Dean, Nancy F.:
Outside Counsel (54)
Abeyta
Andrew
A.
Honeywell International, Inc.
MORRISTOWN, NJ
Anderson
Ryan
E.
Oppedahl & Larson LLP
Dillon, CO
Ansems
Gregory
Matthew
Merchant & Gould, PC
Minneapolis, MN
Bascobert
Michael
R.
Harness Dickey & Pierce, PLC
Bloomfield Hills, MI
Beatus
Carrie
Merchant & Gould, PC
SAN JOSE, NJ
Beninati
John
Merchant & Gould, PC
FAIRFIELD, CT
BERMAN
BERNARD
Skjerven Morrill MacPherson Franklin & Friel...
SAN JOSE, CA
Bickley
Patrick
M.
Faegre Baker Daniels LLP
Indianapolis, IN
BRADFORD
BRUCE
Honeywell International, Inc.
Morristown, NJ
Brueske
Curtis
MORRISTOWN, NJ
Caglar
Oral
Sheppard Mullin LLP
Los Angeles, CA
Cairns
James
Honeywell International, Inc.
CAVANAUGH
GLENN
Metrologic Instruments, Inc.
Blackwood, NJ
Cohen
Dalia
Honeywell International, Inc.
COX
ADAM
Baker & Daniels LLP
FORT WAYNE, IN
DESMOND.
ROBERT
Honeywell International, Inc.
MORRISTOWN, NJ
Drewry
Jamie
M.
Baker & Daniels LLP
Indianapolis, IN
Fliegel
Frederick
David G. Latwesen, Ph.D.
Fredrick
Kris
Merchant & Gould, PC
MORRISTOWN, NJ
Goldberg
Mark
Paschall And Maas Law Office, Llc
ARLINGTON HEIGHTS, IL
Gooding
Arthur
Honeywell International, Inc.
Gregory
Randy
Gregory Ipl
Spokane, WA
Grigel
George
G.
Paine Hamblen LLP
Spokane, WA
Grzelak
Keith
D.
Wells, St. John, Roberts, Gregory & Matkin
Spokane, WA
Harrison
Kevin
Faegre Baker Daniels LLP
Minneapolis, MN
Head
Christa
Faegre Baker Daniels LLP
Hendricksen
Mark
Wayne
wellsstjohn.com Law Firm Placeholder
Spokane, WA
JACKSON.
MIRIAM
Honeywell International, Inc.
MORRISTOWN, NJ
Jacobson
Scott
Honeywell International, Inc.
James
John
Merchant & Gould, PC
Joung
J.
Kenneth
DLA Piper (US) LLP
Kenady
Donald
Gregory Ipl
Spokane, WA
KHALED
DINA
Honeywell International, Inc.
MORRISTOWN, NJ
Lake
James
E.
Parsons Behle & Latimer
BOISE, ID
Latwesen
David
Gregory Ipl
Lemere
Mary
Ann
Honeywell International, Inc.
Morristown, NJ
LUTHER
KURT
Honeywell International, Inc.
MORRISTOWN, NJ
Maas
Maryann
Honeywell, Inc.
MALHOTRA
DEEPAK
Wells, St. John, Roberts, & Et Al.
SPOKANE, WA
Matkin
Mark
S.
Wells, St. John, Roberts, & Et Al.
Spokane, WA
Meagher
Mark
Merchant & Gould, PC
MIOLOGOS
ANTHONY
101 COLUMBIA ROAD, HONEYWELL INTL. Inc.
MORRISTOWN, NJ
Morris
Shannon
Honeywell International, Inc.
MORRISTOWN,
MULLEN.
DOUGLAS
Honeywell International, Inc.
MORRISTOWN, NJ
Paschall
James
Honeywell International, Inc.
Piasecki
David
Honeywell International, Inc.
Price
James
L.
Wells, St. John, Roberts, Gregory & Matkin
Spokane, WA
Roberts
David
JAMES L.PRICE
Shaurette
James
D.
Wells, St. John, Roberts, Gregory & Matkin
SPOKANE, WA
Smyth
Matthew
Merchant & Gould, PC
Szuch
Colleen
Hovey Williams LLP
Van Tassel
Kurt
Honeywell International, Inc.
Wilson
Erika
Honeywell, Inc.
MORRISTOWN, NJ
Worrall
Robert
Honeywell International, Inc.
Washington, DC
4/25/2017
Honeywell International Inc.
Assignee
Application Publication
12769130 20100206133
Method Of Refining Solder Materials Method Of Refining Solder Materials
4/25/2017
Honeywell International Inc.
Assignee
Application Publication Patent
12769130 20100206133 9666547
Method Of Refining Solder Materials Method Of Refining Solder Materials Method Of Refining Solder Materials
7/5/2006
Honeywell International Inc.
Assignee
Application Publication
10585275 20090027857
Heat spreader constructions, intergrated circuitry, methods of forming h... Heat spreader constructions, intergrated circuitry, methods of forming h...
3/13/2006
Honeywell International Inc.
Assignee
Application Publication
11180459 20070013054
Thermally conductive materials, solder preform constructions, assemblies... Thermally conductive materials, solder preform constructions, assemblies...
9/26/2003
Honeywell International Inc.
Assignee
Application Publication
10670319 20040065954
Semiconductor packages, and lead-containing solders and anodes Semiconductor packages, and lead-containing solders and anodes
9/27/1999
Energy Science Laboratories, Inc.
Assignee
Application Patent
09333564 6713151
Compliant Fibrous Thermal Interface Compliant Fibrous Thermal Interface
9/27/1999
Johnson Matthey Electronics, Inc.
Assignee
Application Patent
09333564 6713151
Compliant Fibrous Thermal Interface Compliant Fibrous Thermal Interface
6/24/1998
Johnson Matthey Electronics, Inc.
Assignee
Application Patent
09103416 6436506
Transferrable Compliant Fibrous Thermal Interface Transferrable Compliant Fibrous Thermal Interface
Incoming Payments
Outgoing Payments