Madrid, Ruben

Madrid, Ruben

Add a document

Description
Summary
Document Type	Academic Paper Corporate Document - Internal Corporate Document - Public Court Document Equity Research Government Document - Federal Government Document - State Government Document - Local FBI File Public Records Request Response - FOIA Public Records Request Response - State Non-Profit Report Police Report White Paper
Document Date
Document Source
Source URL
File
	If you would like to be credited for contributing this document, make sure to sign in or sign up first. Once uploaded, your document may not be immediately visible to the public as we review each document for legal issues. Thanks for your patience!

Go Pro to view an analysis and graphs of case roles, types and more.

Filter By From To

	Date Filed	Venue	Case Number	Title	Party Type
	4/30/2021	Superior Court of California, County of Alameda	HG21099672	GOLDMAN SACHS BANK USA v. Madrid	Defendant
	6/2/2010	Superior Court of California, County of Alameda	RG10517963	Madrid v. Lopez	Petitioner
	8/29/2008	Superior Court of California, County of San Francisco	CGC-08-479279	Ruben Madrid v. Melanie Moore et al	Plaintiff
	3/11/2004	United States Patent and Trademark Office	10799895	Carrier With Metal Bumps For Semiconductor Die Packages	Applicant
	11/24/2003	Superior Court of California, County of San Francisco	CGC-03-426707	Audrey Jordan et al v. Shawna Crane et al	Plaintiff
	9/30/2002	United States Patent and Trademark Office	10262170	Semiconductor Die Package Including Drain Clip	Applicant
	5/14/2001	United States Patent and Trademark Office	09855820	Carrier With Metal Bumps For Semiconductor Die Packages	Applicant
	8/4/1998	Superior Court of California, County of San Francisco	CSM-98-774354	Madrid, Ruben v. Obannon, M.	Plaintiff
	11/16/1995	Superior Court of California, County of San Francisco	CGC-95-974059	Rios v. Madrid	Defendant

9 Rows Total

Outside Counsel (209)

	Last Name	First Name	Middle Name	Firm	Location
	Wilson	David		GARY L. CARPENTER
	Winterle	Bret		Kilpatrick Townsend & Stockton, LLP	Winston-salem, Nc,
	Wooten	Alyson	L	Kilpatrick Townsend & Stockton, LLP	Atlanta, GA
	Wylie	Roger	D.	MICHALIK & WYLIE, PLLC	BELLEVUE, IL
	Yeager	Hal		Coudert Brothers
	YIN	LU		Kilpatrick Townsend & Stockton, LLP
	Young	Daniel	Shaw	Kilpatrick Townsend & Stockton, LLP	Denver, CO
	Zigmant.	John		Kilpatrick Townsend & Stockton, LLP	SAN FRANCISCO, CA
	Zylstra	Eric	J.	Kilpatrick Townsend & Stockton, LLP

209 Rows Total	Page 3 of 3 | Go To

Madrid, Ruben has not filed any forms with the United States Securities and Exchange Commission.

	Date Recorded	Party	Role	Document Type	Document No.	Invention Title
	3/20/2019	Bridgestone Americas Tire Operations, LL...	Assignee	Application Publication	16334776 20190236860	Tire Puncture Feedback System Tire Puncture Feedback System
	9/17/2010	Fairchild Semiconductor Corporation	Assignee	Application Publication Patent	11671065 20080185696 7821116	Semiconductor Die Package Including Leadframe With Die Attach Pad With F... Semiconductor Die Package Including Leadframe With Die Attach Pad With F... Semiconductor Die Package Including Leadframe With Die Attach Pad With F...
	7/30/2007	Fairchild Semiconductor Corporation	Assignee	Application Publication Patent	11829793 20080023807 7663211	Dual Side Cooling Integrated Power Device Package And Module With A Clip... Dual Side Cooling Integrated Power Device Package And Module With A Clip... Dual Side Cooling Integrated Power Device Package And Module With A Clip...
	12/15/2003	Fairchild Semiconductor Corporation	Assignee	Application Publication Patent	10262170 20040063240 6777800	Semiconductor Die Package Including Drain Clip Semiconductor Die Package Including Drain Clip Semiconductor Die Package Including Drain Clip
	9/30/2002	Fairchild Semiconductor Corporation	Assignee	Application Publication Patent	10262170 20040063240 6777800	Semiconductor Die Package Including Drain Clip Semiconductor Die Package Including Drain Clip Semiconductor Die Package Including Drain Clip
	5/14/2001	Fairchild Semiconductor Corporation	Assignee	Application Publication Patent	09855820 20020167075 6893901	Carrier With Metal Bumps For Semiconductor Die Packages Carrier With Metal Bumps For Semiconductor Die Packages Carrier With Metal Bumps For Semiconductor Die Packages

6 Rows Total

Madrid, Ruben has not been involved in any trademark assignment transactions in the PlainSite database.

Incoming Payments

This individual has not disclosed any incoming payments from lobbying groups.

Outgoing Payments

This individual has not disclosed any outgoing payments to lobbying groups.