Soga, Tasao
United States
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Outside Counsel (343)
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David |
T. |
Antonelli, Terry, Stout & Kraus, LLP |
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Absher |
Alton |
L. |
Kilpatrick Townsend & Stockton, LLP |
Winston-salem, Nc, |
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Adams |
Scott |
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Davis Wright Tremaine LLP |
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Albert |
Philip |
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Union Bank Bldg |
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Alemanni |
John |
C. |
Kilpatrick Townsend & Stockton, LLP |
Winston-salem, Nc, |
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Allen |
Kenneth |
R. |
Kilpatrick Townsend & Stockton, LLP |
Palo Alto, CA |
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Allen |
Kenneth |
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Steuart St., Tower, One Market Plaza San Fra... |
Virginia Beach, VA |
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Aly |
Amr |
O. |
Kilpatrick Townsend & Stockton, LLP |
Ny 10036, |
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Amanat |
Houtan |
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Kilpatrick Townsend & Stockton, LLP |
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Annis |
David |
C. |
Kilpatrick Townsend & Stockton, LLP |
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Annis |
David |
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Sharp Kabushiki Kaisha |
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Antonelli |
Donald |
Ralph |
Antonelli, Terry, Stout & Kraus, LLP |
Washington, DC |
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Antonelli |
Donald |
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Craig & Burns |
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Aoki |
Kazuo |
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Stevens, Davis, Miller & Mosher, LLP |
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Apple |
Randolph |
Ted |
Kilpatrick Townsend & Stockton, LLP |
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Artuz |
Robert |
John |
Kilpatrick Townsend & Stockton, LLP |
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Artuz |
Robert |
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Sharp Kabushiki Kaisha |
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Auchterlonie |
Thomas |
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Kilpatrick Townsend & Stockton, LLP |
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Barrish |
Mark |
D. |
Kilpatrick Townsend & Stockton, LLP |
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Barrish |
Mark |
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Sharp Kabushiki Kaisha |
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Basarkar |
Girish |
M. |
Kilpatrick Townsend & Stockton, LLP |
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Basarkar |
Girish |
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Sharp Kabushiki Kaisha |
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Bastian |
Kevin |
L. |
Kilpatrick Townsend & Stockton, LLP |
San Francisco, CA |
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Bastian |
Kevin |
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Sharp Kabushiki Kaisha |
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Belagodu |
Akarsh |
P. |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Bennett |
Jesse |
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Kilpatrick Townsend & Stockton, LLP |
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Bergstrom |
James |
T. |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Bergstrom |
James |
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Sharp Kabushiki Kaisha |
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Bernard |
Eugene |
J. |
Oblon, Spivak, McClelland, Maier & Neustadt,... |
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Bernard |
Eugene |
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Sharp Kabushiki Kaisha |
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Bertelson |
Michael |
Allen |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Bertelson |
Michael |
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Digeo, Inc. |
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Blackburn |
Jennifer |
L. |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Blackburn |
Jennifer |
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Sharp Kabushiki Kaisha |
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Blake |
Vanessa |
M. |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Blake |
Vanessa |
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Sharp Kabushiki Kaisha |
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Boring |
Landin |
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Kilpatrick Townsend & Stockton, LLP |
Seattle, WA |
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Bowers |
Carl |
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Kilpatrick Townsend & Stockton, LLP |
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Boyd |
David |
W. |
Kilpatrick Townsend & Stockton, LLP |
San Francisco, CA |
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Boyd |
David |
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Sharp Kabushiki Kaisha |
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Britt |
Juliene |
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Perkins Coie LLP |
SEATTLE, WA |
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Brown |
Kyle |
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Kilpatrick Townsend & Stockton, LLP |
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Brown |
Theodore |
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Kilpatrick Townsend & Stockton, LLP |
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Brundidge |
Carl |
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GARY D. FIELDS, ESQ. |
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Buschmann |
Dana |
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Kilpatrick Townsend & Stockton, LLP |
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Bussey |
Megan |
Elizabeth |
Kilpatrick Townsend & Stockton, LLP |
Ny 10036, |
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Bussey |
Megan |
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Sharp Kabushiki Kaisha |
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Calkins |
Charles |
W. |
United States Army Corps of Engineers |
FT. BELVOIR, DC |
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Calkins |
Charles |
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OFFICE, CHIEF OF ENGINEERS |
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Canning |
Anthony |
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Frommer Lawrence & Haug LLP |
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Cassell |
Nathan |
S. |
Kilpatrick Townsend & Stockton, LLP |
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Cassell |
Nathan |
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Sharp Kabushiki Kaisha |
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Caswell |
Deborah |
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Glenn Patent Group |
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Catmull |
Kelvin |
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Kilpatrick Townsend & Stockton, LLP |
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CHANG |
KO-FANG |
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Kilpatrick Townsend & Stockton, LLP |
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Choi |
Wendy |
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Kilpatrick Townsend & Stockton, LLP |
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Colwell |
Robert |
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PAUL J. WINTERS |
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Colwell. |
Robert |
C. |
Kilpatrick Townsend & Stockton, LLP |
San Francisco, CA |
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Cook |
Roger |
L. |
Kilpatrick Townsend & Stockton, LLP |
San Francisco, CA |
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Cook |
Roger |
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Christensen O'Connor Johnson Kindness PLLC |
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Cooklin |
Kristin |
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Kilpatrick Townsend & Stockton, LLP |
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Cosenza |
Martin II |
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Hauptman Ham, LLP |
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Crall |
Kristin |
Mallatt |
Kilpatrick Townsend & Stockton, LLP |
Palm City, FL |
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Cretsinger |
Cathy |
E. |
Kilpatrick Townsend & Stockton, LLP |
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Cretsinger |
Cathy |
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Sharp Kabushiki Kaisha |
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Curylo |
Robert |
J. |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Dailey |
Robert |
S. |
Kilpatrick Townsend & Stockton, LLP |
Washington, DC |
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Dailey |
Robert |
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Sharp Kabushiki Kaisha |
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Daley |
William |
J. |
Merchant & Gould, PC |
Minneapolis, MN |
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Daley |
William |
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Sharp Kabushiki Kaisha |
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Del Castillo |
Jesus |
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Fellers Snider Blankenship Bailey & Tippens,... |
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Dietze |
Paul |
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Haynes And Boone, LLP |
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Dimino |
Michael |
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Reveo, Inc. |
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Dodson |
Richard |
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Kilpatrick Townsend & Stockton, LLP |
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Doyle |
Kristin |
L. |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Doyle |
Kristin |
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Sharp Kabushiki Kaisha |
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Dresser |
James |
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ALAN E. SCHIAVELLI |
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Durkee |
Christopher |
M. |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Ellenberger |
Ernest |
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Baker Donelson Bearman Caldwell & Berkowitz,... |
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Eng |
Hugo |
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Hoffman-La Roche, Inc. |
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Esq. |
Melvin |
Kraus |
Antonelli, Terry, Stout & Kraus, LLP |
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ESTEBAN |
MICHELLE |
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Schwegman, Lundberg & Woessner, PA |
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Eurek |
Justin |
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Kilpatrick Townsend & Stockton, LLP |
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Ewing |
James |
Lindsay |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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F. |
P.l.l.c. |
James |
Evenson McKeown Edwards & Lenahan, PLLC |
Washington, DC |
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Ferrario |
Matias |
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Kilpatrick Townsend & Stockton, LLP |
Winston-salem, Nc, |
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Ferrario |
Matias |
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Sharp Kabushiki Kaisha |
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Flanagan |
Lisa |
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Sharp Kabushiki Kaisha |
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Flanagan. |
Lisa |
Dornbach |
Kilpatrick Townsend & Stockton, LLP |
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Foster |
Bryan |
Stuart |
Kilpatrick Townsend & Stockton, LLP |
Winston-salem, Nc, |
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Foster |
Bryan |
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Sharp Kabushiki Kaisha |
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Franklin |
Thomas |
D. |
Kilpatrick Townsend & Stockton, LLP |
San Francisco, CA |
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Franklin |
Thomas |
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Sharp Kabushiki Kaisha |
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Gao |
Chuan |
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Kilpatrick Townsend & Stockton, LLP |
San Francisco, CA |
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Gardner |
Jason |
Delmon |
Kilpatrick Townsend & Stockton, LLP |
Atlanta, GA |
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Gardner |
Jason |
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Sharp Kabushiki Kaisha |
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Gardner |
John |
Steven |
Kilpatrick Townsend & Stockton, LLP |
WINSTON-SALEM, NC |
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Garrett-Wackowski |
Euginia |
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Kilpatrick Townsend & Stockton, LLP |
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Gaudry |
Katherine |
S. |
Kilpatrick Townsend & Stockton, LLP |
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Gaudry |
Katherine |
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Sharp Kabushiki Kaisha |
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12/31/2008 |
Hitachi, Ltd. |
Assignee |
Application Publication |
12262382 20090116197 |
Method For Power Semiconductor Module Fabrication, Its Apparatus, Power ... Method For Power Semiconductor Module Fabrication, Its Apparatus, Power ... |
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12/20/2007 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
11873454 20080224303 7547966 |
Power Semiconductor Module Power Semiconductor Module Power Semiconductor Module |
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4/24/2007 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
11739122 20070246833 8004075 |
Semiconductor Power Module Including Epoxy Resin Coating Semiconductor Power Module Including Epoxy Resin Coating Semiconductor Power Module Including Epoxy Resin Coating |
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1/25/2007 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
11657458 20070216013 7671465 |
Power Semiconductor Module Power Semiconductor Module Power Semiconductor Module |
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4/29/2004 |
Hitachi, Ltd. |
Assignee |
Application Publication |
10469215 20040177997 |
Electronic Device Utilizing Mixed Solder Comprising Metallic Ball Phases... Electronic Device Utilizing Mixed Solder Comprising Metallic Ball Phases... |
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3/31/2004 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
10451610 20060061974 7722962 |
Solder Foil, Semiconductor Device And Electronic Device Solder Foil, Semiconductor Device And Electronic Device Solder Foil, Semiconductor Device And Electronic Device |
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7/14/2003 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
10384931 20030224197 6872465 |
Solder Solder Solder |
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7/9/2003 |
Hitachi, Ltd. |
Assignee |
Application Publication |
10384308 20040007384 |
Electronic device Electronic device |
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2/20/2003 |
Hitachi, Ltd. |
Assignee |
Application Publication |
10371303 20030184986 |
Circuit board and electronic device, and method of manufacturing same Circuit board and electronic device, and method of manufacturing same |
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2/27/2002 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
10083543 20020149114 6563225 |
Product Using Zn-al Alloy Solder Product Using Zn-al Alloy Solder Product Using Zn-al Alloy Solder |
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11/16/2001 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
09811445 20010050181 6486411 |
Semiconductor Module Having Solder Bumps And Solder Portions With Differ... Semiconductor Module Having Solder Bumps And Solder Portions With Differ... Semiconductor Module Having Solder Bumps And Solder Portions With Differ... |
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10/15/2001 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
09880773 20010047371 6622162 |
Electronic Document Circulating System Electronic Document Circulating System Electronic Document Circulating System |
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6/8/2001 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
09799486 20020066583 6555052 |
Electron Device And Semiconductor Device Electron Device And Semiconductor Device Electron Device And Semiconductor Device |
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6/8/2001 |
Hitachi, Ltd. |
Assignee |
Application Publication Patent |
09811445 20010050181 6486411 |
Semiconductor Module Having Solder Bumps And Solder Portions With Differ... Semiconductor Module Having Solder Bumps And Solder Portions With Differ... Semiconductor Module Having Solder Bumps And Solder Portions With Differ... |
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6/30/1999 |
Hitachi, Ltd. |
Assignee |
Application Patent |
09323702 6204490 |
Bonding Of Electronic Components To An Electronic Circuit Board With Lea... Bonding Of Electronic Components To An Electronic Circuit Board With Lea... |
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6/29/1998 |
Hitachi, Ltd. |
Assignee |
Application Patent |
08438477 5867809 |
Electric Appliance, Printed Circuit Board, Remained Life Estimation Meth... Electric Appliance, Printed Circuit Board, Remained Life Estimation Meth... |
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7/3/1990 |
Hitachi, Ltd. |
Assignee |
Application Patent |
07337145 4970577 |
Semiconductor Chip Module Semiconductor Chip Module |
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6/13/1988 |
Hitachi, Ltd |
Assignee |
Application Patent |
07202027 4906823 |
Solder Carrier, Manufacturing Method Thereof And Method Of Mounting Semi... Solder Carrier, Manufacturing Method Thereof And Method Of Mounting Semi... |
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4/7/1988 |
Hitachi, Ltd. |
Assignee |
Application Patent |
07178650 4908695 |
Cooling Apparatus And Semiconductor Device Employing The Same Cooling Apparatus And Semiconductor Device Employing The Same |
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6/4/1987 |
Hitachi, Ltd |
Assignee |
Application Patent |
07058255 4821142 |
Ceramic Multilayer Circuit Board And Semiconductor Module Ceramic Multilayer Circuit Board And Semiconductor Module |
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3/13/1987 |
Hitachi, Ltd |
Assignee |
Application Patent |
06940485 4825284 |
Semiconductor Resin Package Structure Semiconductor Resin Package Structure |
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9/22/1986 |
Hitachi, Ltd. |
Assignee |
Application Patent |
06730642 4649990 |
Heat-conducting Cooling Module Heat-conducting Cooling Module |
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8/3/1984 |
Hitachi, Ltd |
Assignee |
Application Patent |
06501995 4491562 |
Thermal Fatigue Resistant Low-melting Point Solder Alloys Thermal Fatigue Resistant Low-melting Point Solder Alloys |
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6/20/1984 |
Hitachi, Ltd. |
Assignee |
Application Patent |
06622584 4562637 |
Method Of Manufacturing Solar Battery Method Of Manufacturing Solar Battery |
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2/7/1983 |
Hitachi, Ltd |
Assignee |
Application Patent |
06464379 4503597 |
Method Of Forming A Number Of Solder Layers On A Semiconductor Wafer Method Of Forming A Number Of Solder Layers On A Semiconductor Wafer |
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10/28/1981 |
Hitachi Ltd |
Assignee |
Application Patent |
06315905 4516149 |
Semiconductor Device Having Ribbon Electrode Structure And Method For Fa... Semiconductor Device Having Ribbon Electrode Structure And Method For Fa... |
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